Underfill
——Structural adhesive
Glob Top
——Peelable adhesive
Edge bond
——Underfill is used to buffer stress of solder joints in flip-chip and maintain mechanical stability. This is especially important when soldering ball grid array (BGA) chips. To reduce the coefficient of thermal expansion (CTE), the adhesive is filled with nano-fillers.
BOA-free, suitable flowability, durability, and strong and long-lasting bonding under harsh conditions.
The main reasons for using potting adhesives over other types of sealants are to provide moisture isolation to prevent short circuits, to provide greater chemical protection in complex components, and to provide resistance to mechanical shock and vibration in challenging environmental.
Encapsulants and sealants are commonly used in electronics as so-called glob top to protect electronic components. The components are protected from moisture, dust, dirt and solvents. Glob top also protects sensitive components from mechanical strain and scratches.
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