Thermal conductive epoxy potting_MCOTI

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SST solid state transformer
SST solid-state transformers operate at high frequency and high power, and have extremely high temperature rise and insulation requirements. They are required to be corona-free and suppress partial discharge. MCOTI epoxy potting glue integrally covers the windings to achieve heat dissipation and isolation, adapting to the harsh working conditions of high-frequency voltage transformation.
SST solid state transformer
Thermal conductive epoxy potting
Thermal conductive potting epoxy glue
As SST develops towards high frequency, high power density and high integration, high-frequency transformers and magnetic devices generate a large amount of heat during operation and must withstand the mechanical stress caused by long-term hot and cold cycles and complex working conditions. Thermal conductive epoxy potting glue is used for the overall potting of SST high-frequency transformer windings, magnetic cores and magnetic components. It improves the thermal management capabilities and long-term operation reliability of magnetic devices by achieving thermal conductivity, heat dissipation, insulation protection and structural reinforcement.

High frequency transformer overall potting

Realize the integration of thermal conduction, insulation and structural fixation

Penetration of windings and tiny gaps, reducing voids and bubbles

Covers winding, core and lead areas to improve long-term reliability

Suitable for high power density applications such as SST, power electronic transformers, high-frequency magnetic integrated devices, etc.

Thermal conductive potting epoxy glue
Product advantages

The viscosity is lower than 2500 mPa·s at 80°C, and it can fully penetrate high-frequency transformer windings and small gaps to form a dense potting structure.

The thermal conductivity is 2.0 W/m·K, which can quickly dissipate heat from the magnetic core and windings, reduce device temperature rise, and improve system thermal management efficiency.

High Tg and low CTE relieve thermal stress caused by hot and cold cycles and improve packaging reliability.

Enhance the mechanical strength of windings and magnetic devices while providing stable electrical insulation performance.

It has good resistance to high and low temperature impact, humidity and heat resistance and environmental aging resistance, and meets the long-term stable operation requirements of SST.

Product parameters
ClassificationcharacteristicMEP 4210MEP 4215MEP 4570
UncuredViscosity after mixing [mPa・s]
Brookfield LVDV
25℃/14#/20rpm: 73,00025℃/14#/10rpm: 75,00025℃/14#/20rpm: 35,916
60℃/14#/20rpm: 7,70060℃/14#/20rpm: 7,80060℃/14#/20rpm: 4,058
80℃/14#/20rpm: 3,20080℃/14#/20rpm: 3,40080℃/14#/20rpm: 2,199
Mixed density [g/cm³]2.592.612.73
Curing conditions2hr@100℃ + 3hr@150℃ + 1hr@180℃2hr@100℃ + 3hr@150℃ + 1hr@180℃2hr@100℃ + 3hr@150℃ + 1hr@180℃
After curinghardnessShore D97Shore D97Shore D92
Thermal conductivity [W/m・K]11.52
Tg [℃]158158173
CTE below Tg [ppm/K]181813
CTE above Tg [ppm/K]737358
Young's coefficient [GPa]5.35.75.2
Shear strength [MPa]131313
Tensile strength [MPa]181818
Volume resistivity [ohm-cm]> 1×10¹⁴> 1×10¹⁴> 1×10¹⁴
Insulation performance [kV/mm]>20>20>20
Operating temperature [℃]-40~200-40~200-40~200


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