Semiconductor_MCOTI

MEMS packaging

MEMS devices contain micromechanical structures, which have extremely high requirements for packaging stress, air tightness and long-term reliability. MCOTI provides conductive adhesive, underfill and frame adhesive solutions for chip fixing, electrical connection and cavity packaging. The material has low stress, low volatility and excellent environmental stability, which can effectively protect sensitive microstructures and improve the long-term reliability of the device in temperature and humidity cycles, vibration and shock environments.

SIP encapsulation

SiP packaging achieves higher integration and smaller product size by highly integrating multiple chips and functional devices into a single package. MCOTI provides conductive adhesive, underfill and precision soldering process solutions, which can effectively enhance the mechanical connection strength between the chip and the substrate, reduce the impact of thermal stress on the solder joints, and improve the package's resistance to drops, thermal cycles and long-term reliability.

Crystal oscillator package

MCOTI's conductive silicone and precision soldering solutions can achieve reliable electrical connections between chips and substrates while taking into account low stress, low volatility and excellent weather resistance to avoid frequency drift and performance attenuation. The material is suitable for packaging of various SMD crystal oscillators and high-precision clock devices, providing long-term and stable frequency guarantee for communication equipment, automotive electronics, industrial control and consumer electronics products.