Data Center_MCOTI

Server power supply

Devices such as inductors and capacitors inside the data center power supply generate heat and are easily affected by vibrations. Thermal conductive interface materials are used to channel heat from the devices. Component reinforcing adhesives reinforce fragile components. Thermal conductive insulating coatings improve the overall insulation withstand voltage. Core adhesive glue fixes magnetic components to simultaneously meet the needs for heat dissipation, insulation and structural vibration resistance.

Optical module

The internal space of the high-speed optical module is compact and the heat dissipation conditions are poor. The bottom of the chip is filled with glue to protect the solder joints of the optoelectronic devices. It is matched with two types of thermal interface materials, thermal gel and thermal pads, to fill the tiny gaps to efficiently dissipate heat from the optical chip and ensure the stability of high-speed optical signal transmission.

Computing power motherboard

The computing power motherboard is equipped with high-power CPU and GPU core chips. It relies on thermally conductive interface materials to quickly export the working heat of the chip. The chip bottom filling glue buffers the stress caused by high and low temperature cycles, protects the chip solder joints, and avoids solder joint cracking and failure during long-term operation of high computing power.

SST solid state transformer

SST solid-state transformers operate at high frequency and high power, and have extremely high temperature rise and insulation requirements. They are required to be corona-free and suppress partial discharge. MCOTI epoxy potting glue integrally covers the windings to achieve heat dissipation and isolation, adapting to the harsh working conditions of high-frequency voltage transformation.