On November 14, the 7th China Digital Power Key Components Innovation Summit (East China) concluded successfully at the Suzhou Hilton Hotel. As one of the most influential annual events in the digital power industry, this year's summit focused on major industrial areas such as AI server power supply, 800V fast charging, SiC/GaN devices, energy storage, and BMS technology. The event brings together 700 industry experts and more than 500 companies to promote in-depth technical exchanges and cooperation across the power electronics ecosystem. At this summit, MCOTI delivered a speech on "Adhesive Solutions for AI Power Supplies and Motherboards", providing solutions for high power density, thermal reliability and insulation performance of electronic products in the AI era. As the demand for AI computing power continues to rise, the power density, thermal management and reliability of power supply systems have become the focus of the industry. MCOTI uses adhesive materials with high thermal conductivity, high insulation, and high temperature resistance to enable key applications such as AI power module packaging, motherboard fixing, insulation protection, and heat dissipation management, helping AI servers achieve more efficient, safer, and more stable power supply performance.
As the demand for AI computing power continues to rise, the power density, thermal management and reliability of power supply systems have become the focus of the industry. MCOTI uses adhesive materials with high thermal conductivity, high insulation, and high temperature resistance to enable key applications such as AI power module packaging, motherboard fixing, insulation protection, and heat dissipation management, helping AI servers achieve more efficient, safer, and more stable power supply performance.
MCOTI’s innovative solution—providing high-strength protective layers for high-power devices
Thermal conductive insulating coating
Replacing the traditional "TIM ceramic/insulating film" stack structure, it improves thermal efficiency, enhances dielectric strength and reduces manufacturing costs.
PCBA conformal paint
Provides high-reliability protection against critical risks such as moisture, salt spray, contaminants and condensation in data center environments.
Core bonding
Equipped with high-frequency and high-flux magnetic components, and by adding precision microbeads, the thickness of the BLT can be extremely controlled, the magnetic flux optimized, and it has excellent structural stability and heat resistance.
IC chip protection
In high power density scenarios, to improve the reliability of chip packaging under mechanical, thermal, chemical and other stresses, MCOTI provides comprehensive customized solutions: underfill, cornerfill and edgebond.
Thermal interface materials
Specifically designed for high-power modules, it fully fills the gaps between components, establishes efficient thermal channels, improves heat dissipation efficiency, and is mechanically reinforced to improve system durability.
Committed to material innovation in the era of artificial intelligence
MCOTI is committed to advancing innovative solutions in high-performance adhesives and materials to achieve safer, more efficient, and more reliable next-generation power systems. We will continue to advance high-performance adhesive technology to support next-generation AI power systems and higher reliability electronic products.
