The interface gap is filled through the flexibility of the material to reduce thermal resistance; the surface tension of the material is adapted to different interface materials such as metal (such as aluminum alloy casing), ceramics (such as laser packaging), and PCB. It can fill gaps without damaging precision components (such as optical fiber interfaces and solder joints) due to excessive compression.
Product advantages:
High thermal conductivity: The thermal conductivity is up to 10.0 W/m·K, ensuring rapid heat dissipation;
Reliable electrical insulation: suitable for high-voltage power modules, such as MOSFET, IGBT, AI power busbar, etc.;
Supports PI / PCM / PSA layer structure, compatible with different application requirements, achieving 250~300μm ultra-thin gasket;
Composite PI film reinforced insulation, composite PCM phase change material (thermal resistance<0.06)
Good flexible fit: can fully fill the interface gaps.
In response to electromagnetic interference problems in AI robots, servers and communication equipment, conductive gaskets can be applied to metal casings, shielding covers and interface parts to form a continuous conductive shielding layer by filling structural gaps, effectively reducing electromagnetic radiation and signal crosstalk, and improving system operation stability and electromagnetic compatibility (EMC).。
Product advantages:
A variety of conductive fillers can be added, such as silver powder, nickel powder, silver-coated nickel, graphite, graphene, carbon nanotubes, etc.;
EMI/EMC electromagnetic shielding;
Ground conduction;
Taking into account both sealing and buffering.
The foam sealing ring can be directly formed in situ on the surface of the housing, controller and sensor housing, accurately filling the assembly gaps to form a continuous and reliable sealing barrier. Its excellent compression and rebound performance can effectively block the intrusion of dust, water vapor and pollutants, help equipment achieve a higher protection level (IP), and improve long-term reliability in complex environments.
Product advantages:
Low density, meeting lightweight needs, density< 0.71g/cm3；
The compression permanent deformation is small during the service life, and the compression permanent deformation is<10%;<>
Excellent elongation at break>100%；
Excellent temperature and humidity resistance;
Excellent waterproof sealing performance.
Thermal pad (standard thermal pad)
product | thickness [mm] | thermal conductivity [W/(m·K)] | Thermal resistance [K-in2/W] | hardness [Shore A] | Dielectric strength [kV/mm] | feature | |
N-SS series | silicone elastomer | 0.050~0.250 | 3.0 | 0.09~0.24 | 60~80 | 3~7 | Ultra-thin gasket with high thermal conductivity |
N-TP series | Silicone elastomer with 25μm PI | 0.075~0.125 | 1.2 | 0.19~0.23 | 60~80 | 6 | High thermal conductivity and insulation properties |
N-PP series | Silicone elastomer, combined with 25μm PCM | 0.075~0.175 | 3.0 | 0.06~0.11 | 60~80 | 3~6 | Lowest thermal resistance, excellent heat dissipation performance |
N-SA series | Silicone elastomer, combined with 5μm AR pressure sensitive adhesive | 0.055~0.155 | 3.0 | 0.09~0.14 | 60~80 | 3~6 | Ultra-thin gasket with high thermal conductivity |
Thermal pad (flexible thermal pad)
product | thickness [mm] | thermal conductivity [W/(m·K)] | hardness [Shore A] | density [g/cm3] | Temperature resistance range [℃] | Dielectric strength [kV/mm] | flame retardant UL 94 |
N-SP 8815 | 0.3-15.0 | 1.5 | 15-75 | 2.6(±0.5) | -40~180 | ≥12 | V0 |
N-SP 8815W | 0.8-15.0 | 1.5(±0.2) | 25-75 | 1.7(+0.2) | -40~180 | ≥12 | V0 |
N-SP 8820 | 0.3-15.0 | 2.0(±0.2) | 25-75 | 2.8(±0.5) | -40~180 | ≥12 | V0 |
N-SP 8830 | 0.3-15.0 | 3.0(±0.2) | 25-75 | 3.0(±0.5) | -40~180 | ≥12 | V0 |
N-SP 8850 | 0.4-10.0 | 5.0(±0.3) | 40-75 | 3.4(±0.5) | -40~180 | ≥12 | V0 |
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