Precision microbeads are mixed with epoxy adhesive to accurately control the air gap size of ferrite cores, and are suitable for structural bonding of magnetic components with high frequency and high stability requirements. Help products optimize effective magnetic flux and achieve mass production with high heat dissipation efficiency and high repeatability. The size of the added precision microbeads can be customized and is available in the range of 0.5~250μm. At the same time, the maximum size tolerance of most microbeads can be controlled within +/-2μm of the average diameter.
The role of air-gap in transformer:
Reduce the magnetic permeability of the magnetic core to prevent magnetic saturation;
Lowering the inductance value increases the amount of current that can be supplied to the transformer before magnetic saturation.
Application advantages:
Precision microbeads reduce air gap tolerance and make leakage inductance more stable;
Ensure the stability of the inductor and optimize the effective magnetic permeability of the magnetic core;
85℃&85% RH @1000hrs excellent mechanical properties after aging;
Shear strength after -40~125℃ @1000 cycle/h >27MPa;
Can correspond to ferrite cores of various shapes;
There is no need to grind the magnetic core or add microbeads in the process, which is more efficient;
It can be integrated into the SMT process to save processes and improve yield, making it suitable for automated mass production.
Bonding process comparison:
Grinding the core (the air gap is controlled by the magnetic column)

Need to add additional beads

MCOTI’s microbead-added adhesive

Product features | MEP 3690LV | MEP 3693 | MEP 3693S | MEP 3697H | MEP 3697HS |
Rheology | viscosity : 430 mPa.s@25oC TI: 1.1 | viscosity : 42,000 mPa.s@25oC TI: 5.6 | viscosity : 42,000 mPa.s@25oC TI: 5.6 | viscosity : 115,000 mPa.s@25oC | viscosity : 115,000 mPa.s@25oC |
Curing method | 10min @150oC Or reflow soldering solidification | 10min @150oC Or reflow soldering solidification | 10min @150oC Or reflow soldering solidification | 10min @150oC Or reflow soldering solidification | 10min @150oC Or reflow soldering solidification |
Shear strength | PCB/PCB:11MPa @130oC | Al/AI:10MPa @130oC | Al/AI:10MPa @130oC | PCB/PCB:17MPa | PCB/PCB:17MPa |
tensile strength | Sample thickness: 1mm Test results:>1.5MPa@200oC 1.6 MPa@250oC | Sample thickness: 1mm Test results:>1.8MPa@200oC 1.6 MPa@250oC | Sample thickness: 1mm Test results:>1.8MPa@200oC 1.6 MPa@250oC | - | - |
hardness | Shore D90 | Shore D93 | Shore D93 | Shore D97 | Shore D97 |
Tg | 148 oC | 109 oC | 109 oC | 143 oC | 143 oC |
thermal conductivity | - | - | - | 1.4 W/(m·K) | 1.4 W/(m·K) |
Bead size | none | none | Can be customized based on air gap design | none | Can be customized based on air gap design |
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