There are many methods for mechanical reinforcement of BGA and other components, whether it is underfill, cornerfill or edgebond. Each method has its own advantages and differs in terms of degree of reinforcement, amount of material, process speed, reworkability and CO2 emissions.

• Excellent performance: strong electrical and thermal connections;

• Efficient process: excellent jet dispensing performance;

• High reliability: excellent aging resistance, excellent resistance to mechanical shock and vibration;

• Strong and durable: high Tg and low CTE, maintaining high bonding strength for a long time.

"Underfill: Improving BGA durability"

Underfill is an epoxy material, often containing a filler (usually silica), used to fill the gaps between the circuit board and BGA/QFN components or other components and to bond the solder balls after curing. The underfill material needs to have a low viscosity in order to flow under the component via capillary action, completely filling the bottom of the chip.

Solution advantages:

• Dispensing glue on the side to fully fill the gaps between the solder balls through capillary action;

• Low viscosity, excellent fluidity;

• Excellent jet dispensing performance;

• Excellent temperature and humidity reliability;

• Highest reliability.

「Edgebond: efficient reinforcement, no overflow”

For package sizes larger than 30mm. In addition, the solder joints do not come into contact with the adhesive, ensuring good reworkability of the components, providing additional flexibility and cost savings.

Solution advantages:

• Only four corners are covered, and the dispensing height is greater than 50% of the chip body;

• Excellent reliability for large BGA packages;

• Minimize changes to product lines and manufacturing processes;

• For large size chips, cost savings&Can be repaired;

• Strengthen the mechanical strength of the four corners of Chip/PCB.

"Cornerfill:SMD component reinforcement"

Corner filling is a simple and time-saving way to strengthen solder joints by defining the extent of the glue wrap based on thermomechanical simulation results. Fill the corners of components with adhesive to reduce stresses precisely where mechanical loads are strongest. Superior jet dispensing performance with excellent temperature and humidity reliability.

Solution advantages:

• Dispensing glue on the four corners to partially fill the gaps between the solder balls;

• Compared with no dispensing, reliability is significantly improved;

• Strengthen the mechanical strength of the four corners of Chip/PCB;

• Can be used for CPU/GPU chip reinforcement.