Potting glue

CN | EN

Product Description Product Advantages Product Application Product Parameters Relevant Solutions
Potting
Create a reliable protective barrier for electronic components. Epoxy and silicone potting glue can fully cover electronic components, effectively preventing moisture, dust, salt spray and chemical corrosion, reducing the risk of short circuits. Excellent insulation, thermal conductivity and buffering and shock-absorbing properties can effectively resist mechanical impact, vibration and harsh environmental influences, comprehensively improving the safety and service life of electronic products.
Potting
Product Advantages

Thermal Conductive Epoxy Potting for Motor

The internal components of motors face multiple challenges such as high temperature, vibration, heat and humidity, and media erosion. MCOTI's high-reliability thermally conductive epoxy potting glue is specially designed for motor stator potting applications. It can fully penetrate the winding gap to achieve comprehensive filling and protection of turns, iron core and structural parts. The material has excellent thermal conductivity, insulation and mechanical strength, which can effectively improve the heat dissipation efficiency of the motor, reduce the operating temperature, and enhance the structural stability and environmental tolerance to meet the long-term reliable operation requirements of new energy vehicles, humanoid robots and industrial motors.


Application advantages:

  • Tg can reach 173℃,  CTE can be as low as 13 ppm/K

  • Class F insulation temperature resistance grade

  • Excellent wetting and filling properties of turns, and full internal filling

  • Excellent high temperature resistance and oil resistance

  • Suitable for round wire and flat wire motor potting

  • Through the high heat dissipation of potting, the motor can operate at lower temperatures and has better durability.

  • Better mechanical stability and structural strength


Reliability test:

  • Thermal shock/temperature cycle: -40~150℃, 1000h cycle: no reduction in bonding strength, no attenuation of thermal conductivity and electrical insulation

  • Transmission oil resistance test: ATF oil 100℃/1000h: no attenuation of electrical insulation, bonding strength>61%

  • Double 85 humidity resistance test: 85℃/85%RH, 1000h: stable insulation, no performance degradation

  • High temperature accelerated aging: constant temperature 150℃/1000h: long-term stable performance indicators


Thermal Conductive Silicone Potting

Two-component thermally conductive silicone potting glue is specially designed for packaging applications with high heat dissipation requirements. It is suitable for power supply packaging. It can be cured at room temperature or heated to achieve optimal adhesion. After curing, the material forms a flexible and reliable elastomer, which can effectively fill the device gap, improve heat conduction efficiency, and reduce the device operating temperature. At the same time, it has excellent high and low temperature resistance, impact resistance and moisture and heat resistance, providing long-term and reliable protection for power modules, magnetic devices, vehicle electronics and industrial control equipment, significantly improving product service life and operational stability.


Application advantages:

  • High thermal conductivity

  • Good adhesion to the shell (aluminum/GF/reinforced PBT)

  • Low shrinkage during curing and little stress on components

  • High reliability, excellent impact resistance

Product Application
OBCs-silicone gel potting
OBCs-silicone gel potting
Motor-Epoxy Potting
Motor-Epoxy Potting
Product Parameters

Thermal Conductive Epoxy Potting for Motor


product

MEP 4210

MEP 4215

MEP 4570

Appearance

Component A: gray

Component B: white

After blending: gray

Component A: gray

Component B: white

After blending: gray

Component A: gray

Component B: white

After blending: gray

Viscosity [mPa.s]

Component A: Paste

Component B: 11,500

After mixing: 73,000@25℃

Component A: Paste

Component B: 11,500

After mixing: 75,000@25℃

Component A: Paste

Component B: 27,200

After mixing: 35,916@25℃

Mixing ratio

1:1

1:1

1:1

Density [g/cm3]

Component A: 2.55

Component B: 2.55

Component A: 2.67

Component B: 2.55

Component A: 2.67

Component B: 2.79

hardness [Shore D]

97

97

92

thermal conductivity [W/(m·K)]

1.0

1.5

2.0

Shear strength [MPa]

13 (aluminum/aluminum)

13 (aluminum/aluminum)

13 (aluminum/aluminum)

Tg  [℃]

158

158

173

CTE [ppm/K]

18/73

18/73

13/65

Dielectric strength [kV/mm]

>20

>20

>20

working temperature

-40~200℃

-40~200℃

-40~200℃


Thermal conductive potting silicone


Product

MSI 2408

MSI 2450

MSI 2410

MSI 2415

MSI 2420

MSI 2420LH

MSI 24200

Appearance

Component A: gray

Component B: white

After blending: gray

Component A: gray

Component B: white

After blending: gray

Component A: gray

Component B: white

After blending: gray

Component A: gray

Component B: white

After blending: gray

Component A: gray

Component B: white

After blending: gray

Component A: gray

Component B: white

After blending: gray

Component A: Transparent and yellowish

Component B: Transparent

After blending: transparent

Viscosity [mPa.s]

After mixing: 1,000-3,000

After mixing: 2,000-4,000

After mixing: 3,000-4,000

After mixing: 2,000-4,000

After mixing: 4,000-6,000

After mixing: 6,000-7,000

After mixing: 700-1,000

Mixing ratio

1:1

1:1

1:1

1:1

1:1

1:1

1:1

Proportion

1.7

1.7

2.0

2.6

2.8

2.8

0.98

Hardness [Shore A]

50

50

60

60

60

10

-

Thermal conductivity [W/(m·K)]

0.7

0.8

1.0

1.5

2.0

2.0

-

flame retardant UL 94

V0

V0

V0

V0

V0

V0

V0


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