Electromagnetic shielding adhesive is formed on-site on the surface of the device through a glue dispensing process. After curing, it serves as signal shielding between signal units within the device and between the device and the external environment.
- Help establish a continuous and smooth conductive circuit;
- Simultaneously fill structural gaps and achieve sealing.
"Thermal Curing/Ni-C System"
• Proper on-site dispensing performance
• Can order tapes with a height of<0.5mm<>
• Excellent adhesion
• High reliability and consistency
• Excellent electromagnetic shielding performance: >90dB
• Signals applied in batches to optical communication module devices
"Room temperature curing/Ni-C system"
• Room temperature cure
• Excellent electromagnetic shielding performance: >90dB
• Excellent sealing
• The particle size of the conductive filler is small, and strips with a height of less than 1.0mm can be dispensed.
• Used in batches for signal shielding of communication base stations and electronic products
"Process advantage: Special-shaped Dispensing"
• Savings on material usage and costs;
• The amount of material used and the required compression force are reduced by forming the die-cast EMC (Electromagnetic Compatibility) conductive adhesive into a triangular shape.
MCOTI non-conductive CIPG silicone sealant series is specially designed for CIPG case frame sealing and high-voltage insulation protection scenarios for electronic devices such as automotive electronic controls, energy storage PCS, and power semiconductor modules.
The entire series of silicone substrates has excellent leakage resistance, moisture resistance and anti-corrosion capabilities. It can isolate water vapor, dust and corrosive media, and avoid leakage and short-circuit failure problems under high-voltage working conditions from the source.
MCOTI can provide liquid foam rubber and molded foam sealing rings, which have excellent electrical properties, excellent high and low temperature tolerance (-50℃~200℃), and good waterproof and moisture-proof properties. At the same time, it has the characteristics of light weight and environmental protection, and is suitable for sealing electronic circuits, plastic or metal structural parts, and wire and cable joints.
Electromagnetic Shielding Conductive Sealant
Product name | MSI 26012 | MSI 26015 | MSI 16004 | MSI 26002 | MSI 1601 |
Chemicalsystem | silicone | silicone | silicone | silicone | silicone |
Proportion | 2.0 | 2.0 | 2.0 | 2.2 | 2.0 |
Components | pairComponents | two-component | single component | two-component | single component |
Curing method | 150℃&30min | 150℃&30min | 150℃&30min | 100℃&30min | 25℃,RH60% |
Volume resistivity [Ω·cm] MIL-DTL 83528C | 0.012 | 0.015 | 0.04 | 0.02 | 0.1 |
Adhesion [N/cm] | ＞10 | ＞ 15 | ＞ 20 | ＞ 20 | ＞10 |
Tensile strength [MPa] | ＞ 0.8 | ＞ 1.0 | ＞1.2 | ＞1.2 | ＞ 1.0 |
Elongation [%] | ＞ 150 | ＞ 150 | ＞ 180 | ＞ 200 | ＞ 150 |
Tear strength [N/mm] | ＞ 4 | ＞ 10 | - | ＞ 4 | - |
Shielding effectiveness [dB] | ＞80 | ＞ 70 | - | ＞ 90 | ＞ 95 |
Application scenarios | Communication base stations, optical communication modules, IGBTs and automotive electronic functional devices and other equipment | Communication base stations, IGBT and other communication equipment | Long-term application in batches of communication base stations, routers and automotive electronic control units | Signal shielding of optical communication module devices | Vehicle electronic ADAS |
Non-conductive sealant
Product name | MSI 1825 | MSI 2820 | MSI 1850 |
chemical type | silicone | silicone | silicone |
Appearance | nearly transparent | A: Transparent B: gray | grey |
Components | single component | two-component | single component |
viscosity@25°C [mPa.s] | 250,000 | After mixing: 165,000 | 30,000 |
Curing conditions | UVA, 2000-3000 mJ/cm2 Cure depth 1-2mm | 30min @120°C 15min @150°C | 30min @150°C |
proportion | 1.08 | 1.1 | 1.05 |
hardness [Shore A] | 20 | 30~40 | 36 |
tensile strength [MPa] | 2.5 | 1.8 | 5.0 |
Shear strength [MPa] | 0.3(aluminum/glass) | 2.0(aluminum/aluminum) | - |
100% modulus [N/mm2 ] | - | 1.1 | |
Elongation at break [%] | 400 | 189 | 350 |
Tear strength [N/mm] | - | - | 27 |
Volume resistivity [Ω·cm] | >1.2x1014 | >1.0x1014 | 1.0 x 1015 |
Dielectric strength [kV/mm] | 18 | 12 | 23 |
Tracking due to leakage (CTI) [V] | > 600 | > 600 | > 600 |
Foam sealant/ring
Product name | MSI 2512 | MSI 1471 |
chemical type | silicone | silicone |
Appearance | AComponents：White BComponents：black | black |
Viscosity@25°C [mPa.s] | AComponents：125,000 BComponents：45,000 After mixing：75,000 | Preformed sealing ring |
Curing conditions | 30mins@150°C | - |
Proportion | After curing：0.51 | 0.71 |
Operating time@23°C [hour] | 2.0 | - |
Hardness [Shore A] | 16 | - |
Tensile strength [MPa ] | 1.0 | >0.4 |
Elongation at break [%] | 450 | >100 |
Shear strength [MPa] | 1.20(aluminum/aluminum) | - |
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