Locally protect and fix electronic components such as resistors, capacitors, inductors, and sensors.
Encapsulation of components and connector leads on PCBA
Very low CTE
Thermal and UV curing
No glue spillage during the second reflow process
Good SIR performance
Enables high-precision dispensing
Used for fixing and sealing protection of various connector terminals, preventing terminal loosening and displacement, and improving anti-vibration performance.
Fast cure
Excellent fluidity, no bubbles
It has good bonding strength with FR4, PI and other base materials.
Excellent temperature and humidity reliability
High viscosity & High thixotropy, the dam fixture can be eliminated and UPH can be improved
Reinforce and protect the Type-C interface solder joints and pin areas to improve plugging and unplugging durability, prevent solder joint cracking and failure, and enhance impact and drop resistance.
Wide application scenarios, protection of electronic devices such as BGA/CSP/connectors
Good electrical performance after reliability testing:
High temperature and high humidity test: 1000H@85℃&85RH%
Thermal cycle test: -40~85 ℃, >1000 cycles
Partially encapsulate and protect IC pins and welding areas to reduce the risk of stress on the pins, prevent fatigue cracking of solder joints, and improve device reliability and lifespan.
Pins fully wrapped
Resistant to mechanical shock and vibration
Excellent temperature and humidity reliability
Excellent bonding properties to a variety of substrates
A protective layer is formed on the top of the chip, device or module to improve the overall protective performance, prevent moisture and pollutant intrusion, and improve the product's environmental adaptability.
High TG, low CTE
Excellent resistance to mechanical impact and temperature shock
Chip solder joint protection to avoid damage caused by bending during assembly
Component Packaging
product | color | viscosity [ mPa.s] | proportion | Curing conditions | hardness [ Shore D ] | Tg [°C] | CTE [ppm/K] |
MAR 5414 | translucent | 12,000 | 1.1 | UV + thermal | 65 | 68 | 86 160 |
MAR 5403 | translucent | 19,000 | 1.1 | UV + thermal | 40 | 35 | 101 216 |
MAR 5420 | transparent | 8,500 | 1.1 | UV + thermal | 62 | 45 | 92 176 |
MAR 5420LV | transparent | 1,800 | 1.1 | UV + thermal | 62 | 45 | - |
Connector Encapsulation
product | color | viscosity [ mPa.s] | proportion | Curing conditions | hardness [ Shore D] | Tg [°C] | CTE [ppm/K] |
MEP 3472 | black | 15,000 | 1.1 | 15~20min@150oC | 82 | 72 | 76 237 |
MEP 3472HV | black | 40,000 | 1.1 | 15min@150oC | 82 | 72 | 76 237 |
USB-C Pin Eackaging
product | color | viscosity [ mPa.s] | proportion | Curing conditions | hardness [ Shore D ] | Tg [°C] | CTE [ppm/K] |
MEP 3734 | yellow | 750 | 1.15 | 10mins@150°C | 70 | 34 | 78 230 |
MEP 3734HV | black | 24,500 | 1.15 | 10mins@150°C | 38 | 120 | 77 228 |
IC Pin Encapsulation
product | color | viscosity [ mPa.s] | proportion | Curing conditions | hardness [ Shore D] | Tg [°C] | CTE [ppm/K] |
MEP 3438 | light yellow | 12,000~18,000 | 1.37 | 10mins@150°C | 80~90 | 93 | 66 136 |
Glob-top Encapsulation
product | color | viscosity [ mPa.s] | proportion | Curing conditions | hardness [ Shore D] | Tg [°C] | CTE [ppm/K] |
MEP 3425 | black | 60,000 | 1.81 | 30mins@150°C | 95 | 173 | 17 35 |
Data Download
