A two-component, solvent-free, thermally conductive filling material. Its basic material is a silicone system. It is suitable for filling the gap between electronic heating components and radiators. Its typical applications include automotive power batteries, new energy battery packs, communication base stations, etc.
High flow rate for efficient distribution
Good coating performance ensures good filling of gaps in larger areas
Good interface wetting ability, low interface thermal resistance
Extremely strong resistance to mechanical shock or vibration
High thermal conductivity: 2.0 ~ 12.0 W/m•K
One-component high-performance silicone thermal conductive gel, including pre-cured/post-cured gel, has low risk of oil separation, can be stored at low temperature/normal temperature, and is specially designed for applications requiring high thermal conductivity interface materials.
High thermal conductivity
Easy to use
Good surface wetting ability
High reliability, good thermal cycle resistance
Extremely low modulus and stress
High thermal conductivity: 2.0 ~ 15.0 W/m•K
One-component thermal grease is non-flowable and contains a highly filled compound that is easy to remove from the substrate. Typical applications include heat sinks, memory and thermal management of chips, power transistors and CPUs.
High temperature resistance
Low BLT, low thermal contact resistance
Good thermal cycle reliability
Low modulus and mechanical stress
Can automatically dispensing/screen printing/squeegee coating
High thermal conductivity: 2.0 ~ 8.0 W/m•K
Thermal Grease
product | MSI 1110 | MSI 1127 | MSI 1101 | MSI 1155 |
Appearance | grey | blue | grey | White |
proportion | 3.2 | 3.5 | 3.6 | 3.3 |
viscosity [Pa.s] | 120 | 120 | 260 | 220 |
BLT [μm] | 15 | 18 | 70 | 40 |
thermal conductivity [W/(m·K)] | 2.0 | 2.7 | 5.5 | 5.5 |
Thermal resistance [℃·cm²/W] | 0.09 | 0.07 | 0.18 | 0.11 |
Oil separation [% ] 8 hours@200℃ | < 1.5 | < 0.3 | < 1.0 | < 1.0 |
volatility [% ] 8 hours@200℃ | < 1.5 | < 0.3 | < 1.0 | < 1.0 |
Dielectric strength [kV/mm] | > 6.0 | > 6.0 | > 5.0 | > 6.0 |
Thermal Conductive Silicone Gap Filler
product | MSI 2332 | MSI 2340 | MSI 2360 | MSI 2360FG | MSI 2380 | MSI 2380FG | MSI 23100 | MSI 23120 |
Components | two-component | two-component | two-component | two-component | two-component | two-component | two-component | two-component |
Mixing ratio | 1:1 | 1:1 | 1:1 | 1:1 | 1:1 | 1:1 | 1:1 | 1:1 |
proportion | After mixing: 3.2 | After mixing: 3.3 | After mixing: 3.3 | After mixing: 3.3 | After mixing: 3.3 | After mixing: 3.3 | After mixing: 3.2 | After mixing: 3.3 |
viscosity | paste | paste | paste | paste | paste | paste | paste | paste |
flow [g/min] | 120 | 80 | > 50 | > 60 | 60 | 60 | > 50 | > 50 |
BLT [μm] | 50 | 85 | 150 | 50 | 180 | 50 | 180 | 150 |
Hardness[Shore OO] | 60 | 40~70 | 40~70 | 40~70 | 40~70 | 40~70 | 40~70 | 30 |
thermal conductivity [W/(m·K)] | 3.2 | 4.0 | 6.0 | 5.8 | 8.0 | 8.0 | 10.0 | 12.0 |
Dielectric strength [kV/mm] | > 6 | > 7 | > 7 | > 7 | > 7 | > 7 | > 8 | > 7 |
Thermal Conductive Gel (pre-cured)
product | MSI 1250 | MSI 1202 | MSI 1145 | MSI 1206 | MSI 1215 | MSI 12015 |
Appearance | black | pink | black | light blue | light blue | gray green |
Resin type | Pre-cured gel | Pre-cured gel | Pre-cured gel | Pre-cured gel | Pre-cured gel | Pre-cured gel |
filler | diamond | diamond | diamond | diamond | diamond | diamond |
viscosity | paste | paste | paste | paste | paste | paste |
proportion | 3.25 | 3.45 | 3.4 | 3.6 | 3.3 | 3.4 |
flow [g/min] | 50 | 42 | 40-60 | - | >15 | ~20 |
volatility[% ] 3Hr@200℃ | < 0.2 | < 0.3 | < 0.5 | < 0.5 | < 0.5 | < 0.2 |
BLT [μm] | 68 | 50 | 68 | 125 | 95 | 150 |
thermal conductivity [W/(m·K)] | 3.5 | 4.0 | 4.4 | 6.0 | 8.0 | 15.0 |
Thermal resistance [℃·cm²/W] | 0.2 | 0.2 | 0.2 | - | - | 0.19 |
Dielectric strength [kV/mm] | > 7.5 | > 7.5 | > 7.5 | > 8.0 | > 8.0 | > 6.0 |
working temperature [℃] | -40 ~ 180 | -40 ~ 180 | -40 ~ 180 | -40 ~ 180 | -40 ~ 180 | -40 ~ 180 |
Thermal Conductive Gel (Post-Cure)
product | MSI 12065PC | MSI 12080PC | MSI 1398 | MSI 12015PC | MSI 12015PC-M | MSI 12018PC |
Resin type | post-cure gel | post-cure gel | post-cure gel | post-cure gel | post-cure gel | post-cure gel |
viscosity | paste | paste | paste | paste | paste | paste |
BLT [μm] | 48 | 48 | 120 | 150 | 150 | 200 |
thermal conductivity [W/(m·K)] | 6.5 | 7.8 | 10.2 | 14.8 | >13.5 | >17.5 |
Thermal resistance [℃·cm²/W] | 0.15 | 0.125 | 0.17 | 0.15 | -- | -- |
working temperature [℃] | -40 ~ 180 | -40 ~ 180 | -40 ~ 180 | -40 ~ 180 | -40 ~ 180 | -40 ~ 180 |
Data Download
