Thermal conductive insulating coating

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Product Description Product Advantages Product Application Product Parameters Relevant Solutions
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Conductive Adhesive
Efficient conduction and stable connection. Conductive adhesive combines low contact resistance, high conductivity and excellent bonding performance, and can achieve simultaneous completion of conduction, fixation and sealing. It has excellent temperature resistance, moisture and heat resistance and long-term reliability, and is widely used in conductive bonding and packaging of crystal oscillators, PCBs, electronic components and precision components.
Conductive Adhesive
Product Advantages

MCOTI Conductive Adhesive

Suitable for use in electrical interconnection and structural bonding applications to increase the reliability of electronic systems. Ensures strong bonding, excellent conductivity and efficient heat dissipation, delivering best-in-class performance. 


  • Various base chemistries: epoxy and silicone 

  • Different curing methods: thermal curing, room temperature curing 

  • A variety of conductive fillers can be added: silver powder, nickel powder, silver-coated nickel, silver-coated copper, graphite, graphene, carbon nanotubes, etc.

  • It can be used for the connection of microelectronic devices, the bonding of flexible circuits, the packaging of display screens, and the manufacture of sensors, capacitors, transistors and other devices.


"MSI 1614 Conductive Silver Adhesive"

MSI 1624 series is a conductive adhesive specially developed for the semiconductor crystal oscillator industry. It has high conductivity and excellent mechanical properties.


Product advantages:

  • Can be adapted to high and low frequency products in the crystal oscillator industry

  • Excellent thermal conductivity (timely dissipation of heat generated by the crystal chip to ensure frequency stability and product life) 

  • Excellent mechanical and electrical conductivity properties 

  • High reliability, excellent performance can be maintained after long-term aging 

  • With high-precision equipment, the dispensing diameter can reach 90μm±10

  • Low Voc content, RoHS compliant, environmentally friendly

Product Application
Crystal oscillator conductive silver adhesive
Crystal oscillator conductive silver adhesive
capacitor conductive silver adhesive
capacitor conductive silver adhesive
Product Parameters

product

MEP 3175

MEP 3450

MSI 1624

Chemicalsystem

Epoxy

Epoxy

silicone

Appearance

silver

silver

grey

viscosity [mPa.s]

12,000

18,310

48,630

thixotropyTI

6.5

4.2

8.0

proportion

3.5

4.0

3.35

solidifycondition

30mins@25°C~175°C

60mins@175°C

4mins@240°C

60mins@150°C

Thrust strength[MPa]

37.0@Si/Copper  25°C

4.1@Si/Copper 250°C

22.5@Si/Copper  25°C

3.5@Si/Copper 250°C

-

Shear strength[MPa]

-

-

2.0@AU/AU

thermal conductivity [W/(m·K)]

2.56

5.0

-

Glass transition temperature Tg  [℃]

65

115

-

thermal expansion coefficientCTE [ppm/K]

55/260

82/184

-

Volume resistivity [Ω·cm]

7.5x10-5

9.6x10-5

2.0x10-4

water absorption [%]

0.89

0.1

-

applicationscene

chipConductive bonding

Tantalum capacitor conductivebonding

crystal oscillatorConductive bonding


Industry Solutions

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