Suitable for use in electrical interconnection and structural bonding applications to increase the reliability of electronic systems. Ensures strong bonding, excellent conductivity and efficient heat dissipation, delivering best-in-class performance.
Various base chemistries: epoxy and silicone
Different curing methods: thermal curing, room temperature curing
A variety of conductive fillers can be added: silver powder, nickel powder, silver-coated nickel, silver-coated copper, graphite, graphene, carbon nanotubes, etc.
It can be used for the connection of microelectronic devices, the bonding of flexible circuits, the packaging of display screens, and the manufacture of sensors, capacitors, transistors and other devices.
"MSI 1614 Conductive Silver Adhesive"
MSI 1624 series is a conductive adhesive specially developed for the semiconductor crystal oscillator industry. It has high conductivity and excellent mechanical properties.
Product advantages:
Can be adapted to high and low frequency products in the crystal oscillator industry
Excellent thermal conductivity (timely dissipation of heat generated by the crystal chip to ensure frequency stability and product life)
Excellent mechanical and electrical conductivity properties
High reliability, excellent performance can be maintained after long-term aging
With high-precision equipment, the dispensing diameter can reach 90μm±10
Low Voc content, RoHS compliant, environmentally friendly
product | MEP 3175 | MEP 3450 | MSI 1624 |
Chemicalsystem | Epoxy | Epoxy | silicone |
Appearance | silver | silver | grey |
viscosity [mPa.s] | 12,000 | 18,310 | 48,630 |
thixotropyTI | 6.5 | 4.2 | 8.0 |
proportion | 3.5 | 4.0 | 3.35 |
solidifycondition | 30mins@25°C~175°C 60mins@175°C | 4mins@240°C | 60mins@150°C |
Thrust strength[MPa] | 37.0@Si/Copper 25°C 4.1@Si/Copper 250°C | 22.5@Si/Copper 25°C 3.5@Si/Copper 250°C | - |
Shear strength[MPa] | - | - | 2.0@AU/AU |
thermal conductivity [W/(m·K)] | 2.56 | 5.0 | - |
Glass transition temperature Tg [℃] | 65 | 115 | - |
thermal expansion coefficientCTE [ppm/K] | 55/260 | 82/184 | - |
Volume resistivity [Ω·cm] | 7.5x10-5 | 9.6x10-5 | 2.0x10-4 |
water absorption [%] | 0.89 | 0.1 | - |
applicationscene | chipConductive bonding | Tantalum capacitor conductivebonding | crystal oscillatorConductive bonding |
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