UV curing equipment_Device list_MCOTI

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Product Description Device Characteristics Product Parameters Relevant Solutions

Home Products Advanced equipment UV curing equipment

UV curing equipment

MCOTI's UV curing equipment has a development history of 12 years, with 4 generations of models iteratively upgraded, a total of 1,000+ units sold, and 20+ customers;
The modular design can flexibly adapt to different production scenarios and achieve rapid integration and efficient application. The equipment can quickly cure large-area UV adhesives within seconds, significantly improving production efficiency and ensuring curing consistency.

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Device Characteristics

Quick curing in seconds, greatly shortening production cycle time

UVA peak light intensity 1200–1400 mW/cm²

High uniformity and stability ensure process consistency

Supports electrodeless lamp and low-temperature UV furnace configuration

Multi-wavelength spectrum optional, suitable for different UV glues

Light source life＞6000 hours

Reduce maintenance frequency and overall operating costs

Product Parameters

parameter	MFS 300S series / Single side UV furnace	MFD 300S series / Double-sided UV furnace
PCB minimum size	50 × 50 mm	50 × 50 mm
PCB maximum size	400 × 400 mm	400 × 400 mm
Clamp thickness	0.2–5 mm	0.2–5 mm
Required conveying height of fixture	25 mm	25 mm
Maximum height of fixture	50 mm	50 mm
light source	Heraeus F300S²VEA	Heraeus F300S²VEA
Spectral type	H、H+、D、V	H、H+、D、V
Conveying width	320 mm	320 mm
Conveyor belt speed deviation	±10%	±10%
UV intensity	1200–2000 mW/cm²	1200–2000 mW/cm²
UV energy (UVA mJ/cm²）	1000–6000 (adjustable)	2000–6000 (adjustable)
cold temperature	≤90℃	≤90℃
Transmission speed (m/min)	0.4–4 (adjustable)	0.4–4 (adjustable)
conveyor belt height	900 ± 20 mm	900 ± 20 mm
PCB transmission method	Forward continuous transmission	Forward continuous transmission
PCB transfer design	chain or roller	chain
Exhaust area	200 mm²	200 mm²
Exhaust flow	23 m³/min × 1.3 m³/min	23 m³/min × 1.3 m³/min
Voltage	AC380V 3 phase+N	AC380V 3 phase+N
current	30 A	65 A
power	3 kW	5.5 kW
Dimensions (mm)	1200(L) × 1000(W) × 1770(H)	2400(L) × 1000(W) × 1800(H)
weight	500 kg	800 kg

Industry Solutions

Consumer Electronics

Innovation in adhesive technology for consumer electronics products is crucial to the miniaturization and reliability improvement of smart devices. It also makes the devices resistant to moisture and sweat and complies with industry standard testing. The increase in the frequency of electronic products puts forward more stringent requirements for circuit design, circuit board materials and adhesives. Adhesives are needed to solve capacitive noise phenomena and electromagnetic interference problems in high-frequency circuits.

New Energy Vehicles

Adhesives are not only "connecting materials" for new energy vehicles, but also core functional materials that ensure their safety, endurance, and reliability. As new energy vehicles upgrade to "high endurance, high safety, and lightweight," technological iterations of adhesives (such as higher thermal conductivity, lower VOC, and faster curing speed) will also become a key research and development direction.

Semiconductor

Adhesive is an essential functional material in semiconductor components, and the tin point machine can optimize packaging performance and process. Help semiconductor packaging companies improve product reliability, significantly shorten production cycles, reduce yield losses, and adapt to the diverse needs from traditional packaging to advanced packaging (such as Chiplets, 3D IC).

Renewable Energy

Growing energy demand, coupled with the harmful impact of fossil fuels on the environment, has led to a significant increase in interest and investment in renewable energy, providing a pathway towards a more sustainable future. Innovative adhesive solutions are critical to improving the performance, durability and cost-effectiveness of energy systems.

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We look forward to having in-depth exchanges with you and exploring more composite material application technologies and solutions.

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