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Excellent electrical conductivity
Suitable for high-precision dispensing process
Low volatility, low pollution
Suitable for some lead-free solder replacement applications
High conductivity and low contact resistance
Has good temperature resistance, moisture and heat resistance and environmental stability
Supports automated precision dispensing and rapid curing processes
Can be applied to Au, Ag, Cu, Si, ceramics and various packaging substrates
Suitable for application scenarios such as MEMS, crystal oscillators, SiP, LED, power devices and semiconductor packaging.