Silver conductive adhesive_MCOTI

CN | EN

MEMS packaging
MEMS devices contain micromechanical structures, which have extremely high requirements for packaging stress, air tightness and long-term reliability. MCOTI provides conductive adhesive, underfill and frame adhesive solutions for chip fixing, electrical connection and cavity packaging. The material has low stress, low volatility and excellent environmental stability, which can effectively protect sensitive microstructures and improve the long-term reliability of the device in temperature and humidity cycles, vibration and shock environments.
MEMS packaging
Silver conductive adhesive Frame bonding Chip protection
Conductive silver glue
MCOTI conductive silver glue uses a high-purity silver powder conductive system to form a stable conductive network through conductive particles to achieve reliable electrical connection and mechanical fixation between chips, electrodes and substrates. The products cover two major technical routes: conductive silicone glue and conductive epoxy glue. The materials have excellent conductive properties, bonding strength and process stability. They can adapt to precision dispensing, rapid curing and high-reliability packaging requirements, and provide long-term and stable conductive connection solutions for electronic components.

Excellent electrical conductivity

Suitable for high-precision dispensing process

Low volatility, low pollution

Suitable for some lead-free solder replacement applications

Conductive silver glue
Product advantages

High conductivity and low contact resistance

Has good temperature resistance, moisture and heat resistance and environmental stability

Supports automated precision dispensing and rapid curing processes

Can be applied to Au, Ag, Cu, Si, ceramics and various packaging substrates

Suitable for application scenarios such as MEMS, crystal oscillators, SiP, LED, power devices and semiconductor packaging.

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