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MEMS Lid frame bonding
Suitable for wafer level and chip level packaging
Micron-level precision dispensing process
Using water as the solvent system, it is suitable for spraying and other processes
Ultra-thin coating thickness can be achieved, and excellent bonding performance can still be obtained at a thickness of 5~10 μm;
High-precision polymer microbeads can be added to accurately control the thickness of the glue layer;
The temperature required for the bonding hot pressing process is low, only 100~120 ℃;
Excellent flexibility and toughness performance;
Excellent heat resistance and long-term aging resistance, the long-term operating temperature can reach 180 ℃;
Environmentally friendly solution, RoHS compliant;
Enhanced products are available to meet specific application needs by adding thermally or electrically conductive fillers.
