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Chip-level precision soldering to achieve stable and reliable electrical interconnection
Process synergy, can be used with conductive silver glue
Suitable for Fine Pitch, tiny pads and high-density packaging
Support high-precision visual positioning and automated soldering process
Minimum spot tin diameter: 150μm
Minimum dot silver glue diameter: 180μm
Dispensing speed: contact piezoelectric valve - 4 times/second
Non-contact piezoelectric valve-20 times/second
High-precision tin quantity control
Fully automated
Improved design significantly extends valve and consumable life
Using high wear-resistant components, low maintenance costs
