Silver conductive adhesive_MCOTI

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SIP encapsulation
SiP packaging achieves higher integration and smaller product size by highly integrating multiple chips and functional devices into a single package. MCOTI provides conductive adhesive, underfill and precision soldering process solutions, which can effectively enhance the mechanical connection strength between the chip and the substrate, reduce the impact of thermal stress on the solder joints, and improve the package's resistance to drops, thermal cycles and long-term reliability.
SIP encapsulation
Silver conductive adhesive Precision soldering dispenser Chip protection
Conductive silver glue
MCOTI conductive silver glue uses a high-purity silver powder conductive system to form a stable conductive network through conductive particles to achieve reliable electrical connection and mechanical fixation between chips, electrodes and substrates. The products cover two major technical routes: conductive silicone glue and conductive epoxy glue. The materials have excellent conductive properties, bonding strength and process stability. They can adapt to precision dispensing, rapid curing and high-reliability packaging requirements, and provide long-term and stable conductive connection solutions for electronic components.

Excellent electrical conductivity

Suitable for high-precision dispensing process

Low volatility, low pollution

Suitable for some lead-free solder replacement applications

Conductive silver glue
Product advantages

High conductivity and low contact resistance

Has good temperature resistance, moisture and heat resistance and environmental stability

Supports automated precision dispensing and rapid curing processes

Can be applied to Au, Ag, Cu, Si, ceramics and various packaging substrates

Suitable for application scenarios such as MEMS, crystal oscillators, SiP, LED, power devices and semiconductor packaging.

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