Thermal interface materials_MCOTI

CN | EN

DCU/ECU
As the automotive electronic and electrical architecture evolves towards domain concentration and central computing platforms, DCU integration continues to increase, power density continues to increase, and higher requirements are placed on heat dissipation, protection and reliable connections. MCOTI adhesives have comprehensive properties such as thermal conductivity, sealing, bonding and insulation, which can effectively improve the thermal management efficiency and environmental adaptability of the controller, ensuring that electronic systems remain stable and reliable under long-term high-load operating conditions.
DCU/ECU
Chip protection Thermal interface materials Component reinforcement Thermal conductive potting
Thermal interface materials
Vehicle-mounted DCU/ECU are highly integrated with high-computing power SoC, power MOS, drive IC, energy storage capacitor and other heating components. The PCB board has a large height difference between components. There are assembly tolerance gaps between the die-cast shell, heat dissipation cover and chip. The air in the gap forms a huge thermal resistance, which can easily cause chip overheating and frequency reduction, controller crash, and premature aging and failure of components. Thermal interface materials can fill the gap between the heat sink and components, establish thermal channels, dissipate the heat generated by the components on the PCBA when working, reduce the thermal resistance of the contact surface and system, and eliminate the bottleneck of heat transfer.

Thermal conductive silicone grease: printable/automatic dispensing, coating thickness 0.02~0.1mm, no curing reaction, the device can be disassembled and reworked;

Thermal conductive caulking agent: suitable for filling gaps with large height differences and obvious tolerance fluctuations in die-casting shells, and has a shock-absorbing and buffering effect;

Thermal conductive gel: high thermal conductivity, single-component high-speed dispensing, no need to die in advance, adaptable to various chip height differences;

Thermal conductive adhesive: It has the dual capabilities of thermal conductivity + structural bonding, which can simplify structural design, reduce fasteners and achieve lightweight;

Thermal pad: light and thin, high thermal conductivity, reproducible, automated attachment and assembly, high production efficiency.

Thermal interface materials
Thermal interface materials
Thermal interface materials
Product advantages

Low interface thermal resistance is less than 0.5℃·cm^2/W@0.2mm

Low modulus, low stress, long-term service without cracking;

Resistant to impact and vibration, meeting automotive grade vibration resistance;

Low BLT@0.18mm can be achieved under low pressure

Very high shape and vertical gap stability

Stored in equipment for long life and easy handling

Can be dispensed using most standard dispensing systems

Silicone grease/gel/caulking agent/adhesive glue/thermal pad to overcome various heat dissipation pain points in one stop

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