Thermal interface materials_MCOTI

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Computing power motherboard
The computing power motherboard is equipped with high-power CPU and GPU core chips. It relies on thermally conductive interface materials to quickly export the working heat of the chip. The chip bottom filling glue buffers the stress caused by high and low temperature cycles, protects the chip solder joints, and avoids solder joint cracking and failure during long-term operation of high computing power.
Computing power motherboard
GPU/CPU chip protection Thermal interface materials
Thermal interface materials
The AI ​​data center motherboard integrates key components such as CPU, GPU, HBM and high-power power supply, and the heat flow density continues to increase. Thermal interface materials (TIMs) are used between chips, radiators and liquid-cooling cold plates to provide stable and reliable thermal management solutions for high-performance computing platforms by reducing interface thermal resistance and improving thermal conductivity, helping data centers achieve higher computing power density and operational reliability.

Thermal conductive silicone grease: printable/automatic dispensing, coating thickness 0.02~0.1mm, no curing reaction, the device can be disassembled and reworked;

Thermal conductive caulking agent: suitable for filling gaps with large height differences and obvious tolerance fluctuations in die-casting shells, and has a shock-absorbing and buffering effect;

Thermal conductive gel: high thermal conductivity, single-component high-speed dispensing, no need to die in advance, adaptable to various chip height differences;

Thermal conductive adhesive: It has the dual capabilities of thermal conductivity + structural bonding, which can simplify structural design, reduce fasteners and achieve lightweight;

Thermal pad: light and thin, high thermal conductivity, reproducible, automated attachment and assembly, high production efficiency.

Thermal interface materials
Product advantages

Lower interface/contact resistance

Low modulus and low stress, high dielectric strength

Stored in equipment for long life and easy handling

Very high shape and vertical gap stability

Can be dispensed using most standard dispensing systems

Glue layer thickness with components (minimum): 0.1mm

Simultaneously taking into account the needs of insulation, shock absorption, and vehicle aging resistance

Silicone grease/gel/caulking agent/adhesive glue/thermal pad to overcome various heat dissipation pain points in one stop

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