Thermal interface materials_MCOTI

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Optical module
The internal space of the high-speed optical module is compact and the heat dissipation conditions are poor. The bottom of the chip is filled with glue to protect the solder joints of the optoelectronic devices. It is matched with two types of thermal interface materials, thermal gel and thermal pads, to fill the tiny gaps to efficiently dissipate heat from the optical chip and ensure the stability of high-speed optical signal transmission.
Optical module
Thermal interface materials Chip protection
Thermal interface materials
Data center optical modules are key heating units in the power supply system. They have three major heat dissipation pain points: high power density heat accumulation, interface gap thermal resistance barrier, high reliability requirements in harsh environments, and optical components are sensitive to contaminants. Thermal interface materials can fill various interface gaps to build continuous and efficient heat conduction channels, while meeting the requirements of low volatility, insulation, anti-aging, and adaptability to automated assembly, ensuring the stable operation of optical modules in high computing power scenarios.

Thermal conductive silicone grease: printable/automatic dispensing, coating thickness 0.02~0.1mm, no curing reaction, the device can be disassembled and reworked;

Thermal conductive caulking agent: suitable for filling gaps with large height differences and obvious tolerance fluctuations in die-casting shells, and has a shock-absorbing and buffering effect;

Thermal conductive gel: high thermal conductivity, single-component high-speed dispensing, no need to die in advance, adaptable to various chip height differences;

Thermal conductive adhesive: It has the dual capabilities of thermal conductivity + structural bonding, which can simplify structural design, reduce fasteners and achieve lightweight;

Thermal pad: light and thin, high thermal conductivity, reproducible, automated attachment and assembly, high production efficiency.

Thermal interface materials
Product advantages

Lower interface/contact resistance

Low modulus and low stress, high dielectric strength

Stored in equipment for long life and easy handling

Very high shape and vertical gap stability

Can be dispensed using most standard dispensing systems

Glue layer thickness with components (minimum): 0.1mm

Simultaneously taking into account the needs of insulation, shock absorption, and vehicle aging resistance

Silicone grease/gel/caulking agent/adhesive glue/thermal pad to overcome various heat dissipation pain points in one stop

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