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One-component heat-cured pure silver conductive silicone
Adapt to automated production processes
The process dispensing performance is stable and the glue can be dispensed continuously and stably for a long time.
Glue dots with a diameter of 180μm and a height of 50~80μm
Low volume resistivity < 2*10^-4 Ω·cm
Excellent bonding properties on gold, silver and silicon surfaces
MSI 1624 has been widely used in products requiring high conductivity and excellent adhesion, such as SMD crystal oscillators, LED and semiconductor packaging.