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Base material: polyimide FPC, component pins, solder
Packaged chips: CSP, bare chip, QFN, resistor, capacitor, inductor
Structure: No glue spillage
Good moisture resistance
Chip solder joint protection to avoid damage caused by bending during assembly
No solder extrusion or spillage during 2 reflow passes
Anti-drop test
Thermal cycle: -40~85 ℃, 1hr/cycle, 500cycles
High temperature and high humidity: 85 ℃ /85%RH, 500hrs
Good SIR performance
