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Magnet and FPC bonding
Main features of the application:
• High viscosity, high thixotropy
• Easy to apply
• High bonding strength
Fast cure under common thermal curing conditions
Halogen-free, RoHS compliant
Product model | MEP 3693 |
chemical type | One-component epoxy thermosetting adhesive |
Appearance | White |
viscosity (25℃） | 42,000 mPa·s |
Curing conditions | heating up25–150℃about3 min；150℃×10 min |
Glass transition temperature (Tg） | 109℃ |
Dielectric strength | 16 kV/mm |
hardness | Shore D 90 |
tensile strength | 47.6 MPa |
PCB-PCBShear strength | 30 MPa |
