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Underfill: It is the most reliable solution. Glue is dispensed on the side of the chip and the gaps between the solder balls are fully filled through capillary action;
Cornerfill: Dispensing glue at the four corners and partially filling the gaps between the solder balls can enhance the mechanical strength of the four corners of the chip/PCB;
Edgebond: only covers the four corners, and the dispensing height is greater than 50% of the chip body. It is suitable for large-sized chips, saving costs & can be repaired.
Excellent performance: strong electrical and thermal connections;
Efficient process: excellent jet dispensing performance;
High reliability: excellent aging resistance, excellent resistance to mechanical shock and vibration;
Strong and durable: high Tg and low CTE, maintaining high bonding strength for a long time;
Environmental compliance: Halogen-free, RoHS compliant.
protection plan | product | color | viscosity [ mPa.s] | Curing conditions | hardness [ Shore ] | Chip thrust strength [ MPa] | Tg [°C] | CTE [ppm/K] |
bottom padding Underfill | MEP 3355 | black | 430 | 10mins@130°C | D 87 | 30 | 110 | 75 206 |
MEP 3324 | black | 7,500 | 10mins@150°C | D 92 | 30 | 147 | 24 82 | |
MEP 3325 | black | 3,000 | 10mins@150°C | D 95 | 30 | 147.4 | 24.8 95.4 | |
MEP 3327 | black | 9,600 | 10mins@150°C | D 95 | 30 | 120 | 28 116 | |
Fixed corners Edgebond | MEP 3362 | black | 45,000 | 10mins@150°C | D 90 | 34 | 98 | 62 175 |
MEP 3327HV | black | 90,000 | 10mins@150°C | D 95 | 35 | 120 | 28 116 | |
Corner padding Cornerfill | MEP 36134 | black | 2,000 | 10mins@150°C | D 88 | 20 | 110 | 54 134 |
