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Thermal conductive silicone grease: printable/automatic dispensing, coating thickness 0.02~0.1mm, no curing reaction, the device can be disassembled and reworked;
Thermal conductive caulking agent: suitable for filling gaps with large height differences and obvious tolerance fluctuations in die-casting shells, and has a shock-absorbing and buffering effect;
Thermal conductive gel: high thermal conductivity, single-component high-speed dispensing, no need to die in advance, adaptable to various chip height differences;
Thermal conductive adhesive: It has the dual capabilities of thermal conductivity + structural bonding, which can simplify structural design, reduce fasteners and achieve lightweight;
Thermal pad: light and thin, high thermal conductivity, reproducible, automated attachment and assembly, high production efficiency.
Lower interface/contact resistance
Low modulus and low stress, high dielectric strength
Stored in equipment for long life and easy handling
Very high shape and vertical gap stability
Can be dispensed using most standard dispensing systems
Glue layer thickness with components (minimum): 0.1mm
Silicone grease/gel/caulking agent/adhesive glue/thermal pad to overcome various heat dissipation pain points in one stop
