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Flexible paste material that can fill assembly tolerances and complex gaps
After curing, a stable thermal conductive interface is formed to achieve efficient heat conduction.
Provides a variety of thermal conductivity and hardness specifications to meet different design needs
High thermal conductivity: 3.2–12.0 W/m·K, meeting different thermal management needs;
The colloid has low hardness, effectively absorbs assembly tolerances and relieves thermal stress;
Two-component is suitable for automated dispensing, with a fixed mixing ratio, stable process and high efficiency;
The highest dielectric strength is >8 kV/mm, meeting the insulation requirements of high-voltage battery packs;
It is resistant to high and low temperatures, resistant to aging, and maintains thermal conductivity and sealing properties for a long time.
product | MSI 2332 | MSI 2340 | MSI 2360 | MSI 2360FG | MSI 2380 | MSI 2380FG | MSI 23100 | MSI 23120 |
Components | two-component | two-component | two-component | two-component | two-component | two-component | two-component | two-component |
Mixing ratio | 1:1 | 1:1 | 1:1 | 1:1 | 1:1 | 1:1 | 1:1 | 1:1 |
proportion | After mixing: 3.2 | After mixing: 3.3 | After mixing: 3.3 | After mixing: 3.3 | After mixing: 3.3 | After mixing: 3.3 | After mixing: 3.2 | After mixing: 3.3 |
viscosity | paste | paste | paste | paste | paste | paste | paste | paste |
flow [g/min] | 120 | 80 | > 50 | > 60 | 60 | 60 | > 50 | > 50 |
BLT [μm] | 50 | 85 | 150 | 50 | 180 | 50 | 180 | 150 |
Hardness[Shore OO] | 60 | 40~70 | 40~70 | 40~70 | 40~70 | 40~70 | 40~70 | 30 |
thermal conductivity [W/(m·K)] | 3.2 | 4.0 | 6.0 | 5.8 | 8.0 | 8.0 | 10.0 | 12.0 |
Dielectric strength [kV/mm] | > 6 | > 7 | > 7 | > 7 | > 7 | > 7 | > 8 | > 7 |
