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Thermal conductive filling between chip and heat sink
Efficient heat transfer between power devices and cold plate
Suitable for high heat-generating devices such as CPU, FPGA, ASIC and power modules
Meet the cooling requirements of high power density communication equipment
Low modulus and low stress
Lower interface/contact resistance
The minimum thickness of the glue layer with components can reach 0.1mm
Flexible filling to compensate for assembly tolerances
Improve the operating temperature of key components and improve system stability
Halogen-free, RoHS compliant