EMI shielding adhesive_MCOTI

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Communication module
Modern communication equipment integrates a large number of high-performance chips, radio frequency devices and high-speed interconnect modules, which continuously generates a large amount of heat. At the same time, it needs to meet strict EMC, protection level and long-term reliability requirements. Adhesives have become a key functional material for communication equipment. Through multiple functions such as heat conduction and heat dissipation, environmental sealing, electrical insulation and EMI electromagnetic shielding, they improve system reliability, extend the service life of equipment, and meet the development needs of lightweight and integrated high-speed communication equipment.
Communication module
Thermal interface materials Thermal conductive insulating coating EMI shielding adhesive Silicon CIPG
Electromagnetic shielding conductive adhesive
High-speed communication equipment has increasingly higher requirements for electromagnetic compatibility (EMC). EMI electromagnetic shielding glue is applied to communication module housings, shielding covers and joint surfaces to form continuous electromagnetic shielding while achieving conductive connections, effectively suppressing electromagnetic leakage and external electromagnetic interference, ensuring signal transmission stability, and achieving the three core functions of electromagnetic shielding, structural bonding, and waterproof and dustproof sealing in one stop.

Nickel carbon high-efficiency electromagnetic shielding

Communication module housing EMI shielding and sealing

Conductive connection between shield and metal joint surface

Automated dispensing process

Electromagnetic shielding conductive adhesive
Product advantages

Three-in-one function: electromagnetic shielding, structural bonding, waterproof and dustproof sealing

Low volume resistivity:< 0.012 Ω・cm

High-efficiency EMI interference protection: shielding effectiveness up to > 95dB

Triangular special-shaped dispensing process saves costs

Compatible with multiple substrates, the cavity separation and isolation effect is excellent

Product parameters

Product name

MSI 26012

MSI 26015

MSI 16004

MSI 26002

MSI 1601

chemical system

silicone

silicone

silicone

silicone

silicone

proportion

2.0

2.0

2.0

2.2

2.0

Components

two-component

two-component

single component

two-component

single component

Curing method 

150&30min

150℃&30min

150℃&30min

100℃&30min

25℃,RH60%

Volume resistivity [Ω·cm]

MIL-DTL 83528C

0.012

0.015

0.04

0.02

0.1

adhesion [N/cm]

10

 15

 20

 20

10

tensile strength [MPa]

 0.8

 1.0

1.2

1.2

 1.0

Elongation [%]

 150

 150

 180

 200

 150

Tear strength  [N/mm]

 4

 10

 4

-

Shielding effectiveness [dB]

80

 70

-

 90

 95


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