Thermal interface materials_MCOTI

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Communication module
Modern communication equipment integrates a large number of high-performance chips, radio frequency devices and high-speed interconnect modules, which continuously generates a large amount of heat. At the same time, it needs to meet strict EMC, protection level and long-term reliability requirements. Adhesives have become a key functional material for communication equipment. Through multiple functions such as heat conduction and heat dissipation, environmental sealing, electrical insulation and EMI electromagnetic shielding, they improve system reliability, extend the service life of equipment, and meet the development needs of lightweight and integrated high-speed communication equipment.
Communication module
Thermal interface materials Thermal conductive insulating coating EMI shielding adhesive Silicon CIPG
Thermal interface materials
As the power density of communication equipment continues to increase, CPUs, FPGAs, ASICs and power devices continue to generate a large amount of heat. Thermal interface materials are used between chips, radiators, and cold plates to fill microscopic gaps in the interface, reduce interface thermal resistance, improve heat dissipation efficiency, and ensure long-term stable operation of equipment.

Thermal conductive filling between chip and heat sink

Efficient heat transfer between power devices and cold plate

Suitable for high heat-generating devices such as CPU, FPGA, ASIC and power modules

Meet the cooling requirements of high power density communication equipment

Thermal interface materials
Thermal interface materials
Thermal interface materials
Product advantages

Low modulus and low stress

Lower interface/contact resistance

The minimum thickness of the glue layer with components can reach 0.1mm

Flexible filling to compensate for assembly tolerances

Improve the operating temperature of key components and improve system stability

Halogen-free, RoHS compliant

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