Core bonding_MCOTI

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Devices such as inductors and capacitors inside the data center power supply generate heat and are easily affected by vibrations. Thermal conductive interface materials are used to channel heat from the devices. Component reinforcing adhesives reinforce fragile components. Thermal conductive insulating coatings improve the overall insulation withstand voltage. Core adhesive glue fixes magnetic components to simultaneously meet the needs for heat dissipation, insulation and structural vibration resistance.
Server power supply
Thermal conductive insulating coating Core bonding Thermal interface materials Component reinforcement
Core bonding
The field of power electronics has put forward higher requirements for efficiency/power density. High-frequency magnetic components are getting smaller and smaller, and planar transformers are appearing more and more frequently, replacing the traditional larger winding transformers.
MCOTI specially designs and develops a series of adhesive products for ferrite core bonding of planar transformers to meet the diverse application needs of customers.

The glue comes with precision microbeads, and the air gap is precisely controlled by the microbeads in thickness.

The CV value of microbead size is <3.5%, keeping the air gap consistent and uniform.

Microbeads have small tolerance, average diameter tolerance +/-2μm

Customized microbead size: 0.5 ~250μm

Core bonding
Product advantages

Optimize the effective magnetic flux to ensure the stability of the sensor;

Can correspond to various intervals;

Suitable for ferrite cores of various shapes;

No additional grinding or stirring is required in the process;

The SMT process can be integrated and solidified through reflow soldering, resulting in high production efficiency.

Product parameters
Product featuresMEP 3690LVMEP 3693MEP 3693SMEP 3697HMEP 3697HS
RheologyViscosity: 430 mPa·s@25℃Viscosity: 42,000 mPa·s@25℃Viscosity: 42,000 mPa·s@25℃Viscosity: 115,000 mPa·s@25℃Viscosity: 115,000 mPa·s@25℃
TI: 1.1TI: 5.6TI: 5.6
Curing method10min @150℃10min @150℃10min @150℃10min @150℃10min @150℃
Or reflow soldering solidificationOr reflow soldering solidificationOr reflow soldering solidificationOr reflow soldering solidificationOr reflow soldering solidification
Shear strengthPCB/PCB:11MPa @130℃Al/Al:10MPa @130℃Al/Al:10MPa @130℃PCB/PCB:17MPaPCB/PCB:17MPa
tensile strengthSample thickness: 1mmSample thickness: 1mmSample thickness: 1mm--
Test results:Test results:Test results:
1.5MPa@200℃1.8MPa@200℃1.8MPa@200℃
1.6 MPa@250℃1.6 MPa@250℃1.6 MPa@250℃
hardnessShore D90Shore D93Shore D93Shore D97Shore D97
Tg148 ℃109 ℃109 ℃143 ℃143 ℃
thermal conductivity---1.4 W/(m·K)1.4 W/(m·K)
Bead sizenonenoneCan be customized based on air gap designnoneCan be customized based on air gap design


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