Thermal interface materials_MCOTI

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Server power supply
Devices such as inductors and capacitors inside the data center power supply generate heat and are easily affected by vibrations. Thermal conductive interface materials are used to channel heat from the devices. Component reinforcing adhesives reinforce fragile components. Thermal conductive insulating coatings improve the overall insulation withstand voltage. Core adhesive glue fixes magnetic components to simultaneously meet the needs for heat dissipation, insulation and structural vibration resistance.
Server power supply
Thermal conductive insulating coating Core bonding Thermal interface materials Component reinforcement
Thermal interface materials
The data center server power supply operates at full load 24/7 for a long time, and the inlet air temperature of the computer room can reach 40~55°C, posing multiple heat dissipation problems. Thermal interface materials can fill the gaps between radiators and components to establish thermal channels, while taking into account insulation, shock absorption, low pollution, adaptability to automated mass production, and ensuring long-term stable output of server power supplies at full load.

Thermal conductive silicone grease: printable/automatic dispensing, coating thickness 0.02~0.1mm, no curing reaction, the device can be disassembled and reworked;

Thermal conductive caulking agent: suitable for filling gaps with large height differences and obvious tolerance fluctuations in die-casting shells, and has a shock-absorbing and buffering effect;

Thermal conductive gel: high thermal conductivity, single-component high-speed dispensing, no need to die in advance, adaptable to various chip height differences;

Thermal conductive adhesive: It has the dual capabilities of thermal conductivity + structural bonding, which can simplify structural design, reduce fasteners and achieve lightweight;

Thermal pad: light and thin, high thermal conductivity, reproducible, automated attachment and assembly, high production efficiency.

Thermal interface materials
Product advantages

Lower interface/contact resistance

Low modulus and low stress, high dielectric strength

Stored in equipment for long life and easy handling

Very high shape and vertical gap stability

Can be dispensed using most standard dispensing systems

Glue layer thickness with components (minimum): 0.1mm

Simultaneously taking into account the needs of insulation, shock absorption, and vehicle aging resistance

Silicone grease/gel/caulking agent/adhesive glue/thermal pad to overcome various heat dissipation pain points in one stop

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