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Fast cure
Black/white gel optional
Transparent visual gel optional
Suitable for high mechanical bonding strength scenarios
Quick-drying moisture curing improves production line efficiency
Good adhesion and excellent flexibility
Highly elastic buffer structure, long-term vibration and impact resistance
- 40℃ to 180℃ high and low temperature impact without cracking or degumming
Recommended base materials: PA, PC, PCB, aluminum, stainless steel
product | MSI 1540W | MSI 1540B | MSI 1505 |
chemical system | silicone | silicone | silicone |
Appearance | White | black | transparent |
viscosity [mPa·s] | semi-flowing | semi-flowing | 30,000~40,000 |
proportion | 1.25 | 1.30 | 1.03 |
Curing method | Surface stem 3~15mins@25°C, 50% RH fully cured 7sky@25°C, 50% RH | Surface stem 3~15mins@25°C, 50% RH fully cured 7sky@25°C, 50% RH | Surface stem 3~20mins @25°C, 50% RH fully cured 24hrs@25°C, 50% RH |
Shear strength [Mpa] | 1.5 （Al / Al） 2.4（PCB / PCB） 1.4（SUS304 / SUS304 ） | 1.5 （Al / Al） 2.4（PCB / PCB） 1.4（SUS304 / SUS304 ） | --- |
hardness [Shore A] | 40 | 40 | 15~25 |
Operating temperature range[oC] | -40~180 | -40~180 | -40~180 |
Application scenarios | PCBReinforcement of upper components，FPCReinforce | PCBReinforcement of upper components，FPCReinforce | PCBReinforcement of upper components and sealing of power modules |
