Thermal interface materials_MCOTI

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Control module
As the core of robot intelligent decision-making and motion control, the AI ​​robot control module (CU) integrates high-computing AI chips, power devices and high-speed communication units. It generates a large amount of heat during the continuous operation process and faces long-term challenges in vibration, dust and hot and humid environments. MCOTI provides overall material solutions to achieve efficient thermal conductivity, structural reinforcement and environmental protection, and comprehensively improve the reliability, stability and service life of the control module.
Control module
Thermal conductive insulating coating Chip protection Thermal interface materials Thermal conductive potting silicone Non-conductive/conductive sealant
Thermal interface materials
The joint servo motors and built-in drive modules of AI humanoid robots, industrial collaborative robots, and embodied intelligent robots continue to move for a long time, frequently start and stop, and the temperature rises sharply under locked-rotor conditions. The thermal interface material fills the interface gaps between the components of the module to build a continuous and efficient heat conduction channel. It also takes into account the four characteristics of shock absorption and buffering, electrical insulation, moisture-proof sealing, and low volatility and cleanliness. It stably controls the temperature rise of the motor and drive board to ensure that the robot can operate continuously with high precision for a long time.

Thermal conductive silicone grease: printable/automatic dispensing, coating thickness 0.02~0.1mm, no curing reaction, the device can be disassembled and reworked;

Thermal conductive caulking agent: suitable for filling gaps with large height differences and obvious tolerance fluctuations in die-casting shells, and has a shock-absorbing and buffering effect;

Thermal conductive gel: high thermal conductivity, single-component high-speed dispensing, no need to die in advance, adaptable to various chip height differences;

Thermal conductive adhesive: It has the dual capabilities of thermal conductivity + structural bonding, which can simplify structural design, reduce fasteners and achieve lightweight;

Thermal pad: light and thin, high thermal conductivity, reproducible, automated attachment and assembly, high production efficiency.

Thermal interface materials
Product advantages

Lower interface/contact resistance

Low modulus and low stress, high dielectric strength

Stored in equipment for long life and easy handling

Very high shape and vertical gap stability

Can be dispensed using most standard dispensing systems

Glue layer thickness with components (minimum): 0.1mm

Simultaneously taking into account the needs of insulation, shock absorption, and vehicle aging resistance

Silicone grease/gel/caulking agent/adhesive glue/thermal pad to overcome various heat dissipation pain points in one stop

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