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Non-conductive sealant (CIPG/FIPG) is applied to the control module housing, cover plate, connector and other joint surfaces to form a continuous sealing ring to achieve waterproof, dustproof, moisture-proof and weather-resistant protection. It can effectively replace traditional rubber seals, meet IP67/IP69K and other high protection level requirements, and is suitable for automated dispensing production.
Conductive EMI sealant is applied to the joint surface of the CU metal shell to provide environmental sealing while forming a continuous conductive path, effectively reducing electromagnetic leakage and external electromagnetic interference, improving the EMC performance of the control unit, and ensuring stable operation of high-speed signal and control systems.
CIPG in-situ forming seal can reduce the number of parts and assembly processes
FIPG is lightweight and has high compression rate, which can effectively compensate for assembly tolerances and shell deformation.
Integrated sealing and EMI shielding solution to meet the sealing and electromagnetic compatibility needs of different modules
Effectively waterproof, dustproof, moisture-proof and salt spray resistant, improving the long-term reliability of the module
Good resistance to high and low temperatures, hot and cold cycles and vibration resistance
Automated dispensing provides production efficiency and consistency
