Chip protection_MCOTI

Improve component reliability with our innovative adhesive materials for solder joint reinforcement. We provide tailor-made solutions that support a variety of connection stabilization and optimization methods to help you ensure that semiconductor chips and other electronic devices maintain excellent performance throughout their life cycle. There are various methods for mechanical reinforcement of BGAs and other components, whether underfill, corner filling or corner fixing, each method has its own advantages and varies in terms of degree of reinforcement, amount of material, process speed, reworkability and CO2 emissions.