Thermal interface materials_MCOTI

The core heat sources of new energy vehicle electronic controls are power devices such as IGBTs, SiC power tubes, and high-frequency transformers. There are microscopic unevenness on the contact surface between the device metal substrate, PCB board and water-cooling case/radiator, and the thermal conductivity of the interlayer air is extremely low, forming a huge contact thermal resistance. At the same time, the assembly tolerance of the electronically controlled die-casting case and chip components has a large floating range (0.02~5mm), coupled with the severe working conditions of vehicle wide temperature cycles, high-frequency vibration, and 800V high voltage, it is easy to cause local overheating and device aging and breakdown. Thermal interface materials can fill the gap between the heat sink and components, establish thermal channels, dissipate the heat generated by the components on the PCBA when working, reduce the thermal resistance of the contact surface and system, and eliminate the bottleneck of heat transfer.