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Non-conductive sealant (CIPG/FIPG) is applied to the joint surfaces of the electronic control module housing, cover plate and connector to form a continuous sealing ring to achieve waterproof, dustproof, moisture-proof and weather-resistant protection. It can effectively replace traditional rubber seals, meet IP67/IP69K and other high protection level requirements, and is suitable for automated dispensing production.
Conductive EMI sealant is applied to the joint surfaces of metal shells such as DCU, ECU, OBC, BMS, etc. to form a continuous conductive path while achieving environmental sealing, effectively suppressing electromagnetic leakage and external electromagnetic interference, improving the EMC performance of electronic control modules, and meeting the electromagnetic compatibility requirements of high-frequency and highly integrated electronic systems of new energy vehicles.
CIPG in-situ forming seal can reduce the number of parts and assembly processes
FIPG is lightweight and has high compression rate, which can effectively compensate for assembly tolerances and shell deformation.
Integrated sealing and EMI shielding solution to meet the sealing and electromagnetic compatibility needs of different electronic control modules
Effectively waterproof, dustproof, moisture-proof and salt spray resistant, improving the long-term reliability of the module
Good resistance to high and low temperatures, hot and cold cycles and vibration resistance
Automated dispensing provides production efficiency and consistency
