Ferrite Core bonding_MCOTI

CN | EN

Electronic control
New energy vehicle electronic controls are iterating in the direction of high voltage, high power integration, small size and lightweight, and have long been faced with severe vehicle working conditions such as high temperature, strong vibration, and alternating temperature and humidity. MCOTI adhesive can simultaneously achieve insulation and heat conduction, sealing and vibration damping, and bonding of dissimilar materials. It adapts to the trend of electronic control upgrades and is a key supporting material to ensure the stable and safe operation of electronic control.
Electronic control
PCBA conformal coating Ferrite Core bonding Thermal conductive insulating coating Chip protection Thermal interface materials Non-conductive/conductive sealant Thermal conductive potting
Core bonding
The field of power electronics has put forward higher requirements for efficiency/power density. High-frequency magnetic components are getting smaller and smaller, and planar transformers are appearing more and more frequently, replacing the traditional larger winding transformers.
MCOTI specially designs and develops a series of adhesive products for ferrite core bonding of planar transformers to meet the diverse application needs of customers.

The glue comes with precision microbeads, and the air gap is precisely controlled by the microbeads in thickness.

The CV value of microbead size is <3.5%, keeping the air gap consistent and uniform.

Microbeads have small tolerance, average diameter tolerance +/-2μm

Customized microbead size: 0.5 ~250μm

Core bonding
Product advantages

Optimize the effective magnetic flux to ensure the stability of the sensor;

Can correspond to various intervals;

Suitable for ferrite cores of various shapes;

No additional grinding or stirring is required in the process;

The SMT process can be integrated and solidified through reflow soldering, resulting in high production efficiency.

Product parameters
Product featuresMEP 3690LVMEP 3693MEP 3693SMEP 3697HMEP 3697HS
RheologyViscosity: 430 mPa·s@25℃Viscosity: 42,000 mPa·s@25℃Viscosity: 42,000 mPa·s@25℃Viscosity: 115,000 mPa·s@25℃Viscosity: 115,000 mPa·s@25℃
TI: 1.1TI: 5.6TI: 5.6
Curing method10min @150℃10min @150℃10min @150℃10min @150℃10min @150℃
Or reflow soldering solidificationOr reflow soldering solidificationOr reflow soldering solidificationOr reflow soldering solidificationOr reflow soldering solidification
Shear strengthPCB/PCB:11MPa @130℃Al/Al:10MPa @130℃Al/Al:10MPa @130℃PCB/PCB:17MPaPCB/PCB:17MPa
tensile strengthSample thickness: 1mmSample thickness: 1mmSample thickness: 1mm--
Test results:Test results:Test results:
1.5MPa@200℃1.8MPa@200℃1.8MPa@200℃
1.6 MPa@250℃1.6 MPa@250℃1.6 MPa@250℃
hardnessShore D90Shore D93Shore D93Shore D97Shore D97
Tg148 ℃109 ℃109 ℃143 ℃143 ℃
thermal conductivity---1.4 W/(m·K)1.4 W/(m·K)
Bead sizenonenoneCan be customized based on air gap designnoneCan be customized based on air gap design


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