Thermal interface materials_MCOTI

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PCB hard board assembly
PCBs (Printed Circuit Boards) have always faced the challenge of the miniaturization trend, which is to ensure that the size continues to decrease, but the solder joints and components continue to work reliably.
To protect sensitive components, adhesives are applied to PCBs as top encapsulants, coatings or underfills for chips, as well as thermal management solutions to ensure product quality and reliability.
PCB hard board assembly
Component packaging Connector reinforcement Chip protection Conformal coating Thermal interface materials Conductive adhesive
Thermal interface materials
In response to the heat dissipation needs of consumer electronics PCB assembly, MCOTI provides complete thermal interface material solutions, including thermally conductive caulking agent, thermally conductive silicone grease, thermally conductive gel, thermally conductive adhesive and thermally conductive gaskets. The product can closely fit the interfaces of different devices, fill air gaps, improve heat conduction efficiency, effectively reduce the operating temperature of heating devices such as CPU, PMIC, memory, etc., and improve the reliability and service life of the entire machine.

Thermal conductive caulking agent: 3.2~12 W/m·K

Thermal conductive silicone grease: 2~8 W/m·K

Thermal conductive gel: 2~15 W/m·K

Thermal conductive adhesives include one-component silicone, two-component acrylic and epoxy systems

Fully fill the tiny gaps between the radiator and heating components

Thermal interface materials
Product advantages

Low modulus and low stress

Materials with lower interface/contact resistance

BLT can be as small as 0.1mm

Very high shape and vertical gap stability

Stored in equipment for long life and easy handling

Can be dispensed using most standard dispensing systems

Halogen-free, RoHS compliant

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