Chip protection_MCOTI

MCOTI provides a variety of chip enhancement and protection solutions to help you ensure that semiconductor chips and other electronic devices maintain excellent performance throughout their life cycle. There are many methods for mechanical reinforcement of BGA and other components, whether it is underfill, cornerfill or edgebond. Each method has its own advantages and differs in terms of degree of reinforcement, amount of material, process speed, reworkability and CO2 emissions.