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Relieve stress caused by plugging, dropping and thermal cycling, and reduce the risk of solder joint cracking and desoldering
Suitable for auxiliary fixation of shielding covers, inductors, capacitors, transformers and other components
Adapted to high-speed automatic dispensing process to meet the mass production needs of consumer electronics products
Fast cure
Good dispensing performance
Excellent drop and impact resistance
Good adhesion to various substrates (including LCP, PBT)
| product | color | Viscosity [mPa·s] | Density [g/cm³] | Curing conditions | Hardness [Shore D] | Tg [℃] | CTE [ppm/K] | Operating temperature [℃] |
| MEP 3472 | black | 15000 | 1.1 | 15~20min@150℃ | 82 | 72 | 76(< Tg) | -40~260 |
| 237(> Tg) | ||||||||
| MEP 3472HV | black | 40000 | 1.1 | 15min@150℃ | 82 | 72 | 76(< Tg) | -40~260 |
| 237(> Tg) |
