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Composite Materials Advanced equipment

MCOTI Composite Materials

MCOTI's high-performance composite materials and functional coating materials rely on diversified chemical systems and flexible curing solutions to build a complete product matrix covering electronic packaging, thermal and electrical conductivity, structural bonding, and electromagnetic shielding.
Our material solutions are widely used in consumer electronics, new energy vehicles, semiconductors and high-end industrial fields, providing reliable integrated bonding, protection and functional solutions for precision manufacturing.

Ferrite Core Bonding

Thermal Conductive Insulation Coating

Conformal Coating

IC Protection Adhesive

Potting

Sealant

Encapsulant

Thermal Interface Materials

Conductive Adhesive

Preformed Products

Display Bonding Adhesive

Ferrite Core Bonding

MCOTI ferrite core bonding adhesive is specially developed for planar transformers. The core is an adhesive formula with self-contained microbeads. It can accurately control the air gap between magnetic cores through the adhesive layer thickness (BLT). It provides a stable and repeatable magnetic core bonding solution for planar transformers. It helps products achieve mass production with high heat dissipation efficiency and high repeatability. It is perfectly suitable for new energy vehicle charging piles and DC-DC. Applications in modules, vehicle chargers, industrial power supplies, consumer electronics, aerospace and photovoltaic wind power inverters and other fields.

Thermal Conductive Insulation Coating

MCOTI's thermally conductive insulation coating is a one-part heat-curing water-based epoxy spray material that can be sprayed directly on the surface of a radiator or metal base plate to form a dense, continuous, and strong-adhesion thermally conductive insulating coating. Suitable for high heat dissipation density scenarios such as AI power supplies, high-power DC/DC, OBC, and server VRM modules.

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Conformal Coating

It provides a reliable invisible protective layer for PCBA, with a coverage rate of components and chip pins as high as 99.99%. It can effectively prevent moisture, salt spray, mildew, dust and electrochemical corrosion, significantly improving the long-term reliability of electronic components. The material has excellent anti-sag performance and edge coverage ability, supports "UV+moisture curing" dual curing process, taking into account fast production cycle and full curing of complex shadow areas.

IC Protection Adhesive

MCOTI provides customized mechanical reinforcement solutions: Underfill, Cornerfill, and Edgebond, supporting a variety of connection stabilization and optimization methods to ensure that semiconductor chips and other electronic devices maintain excellent performance throughout their life cycle.

Potting

Create a reliable protective barrier for electronic components. Epoxy and silicone potting glue can fully cover electronic components, effectively preventing moisture, dust, salt spray and chemical corrosion, reducing the risk of short circuits. Excellent insulation, thermal conductivity and buffering and shock-absorbing properties can effectively resist mechanical impact, vibration and harsh environmental influences, comprehensively improving the safety and service life of electronic products.

Sealant

Create a one-stop electronic sealing solution. Conductive EMI glue achieves efficient electromagnetic shielding and reliable conductive connection. Non-conductive CIPG organic silicone glue provides high-voltage insulation, waterproof sealing and weather-resistant protection. It has excellent buffering and shock absorption and cold and hot cycle stress relief capabilities, providing long-term and reliable sealing protection for energy storage, vehicle electronics, industrial control and consumer electronics.

Encapsulant

MCOTI's encapsulant is designed to provide high-reliability protection solutions for electronic components and precision connection parts. It can be used in components, connectors, USB Type-C interfaces, IC pins and top encapsulation, etc. The product has excellent fluidity, adhesion, insulation and environmental resistance, and can effectively improve the mechanical strength, moisture-proof and corrosion-proof capabilities and long-term reliability of the device.

Thermal Interface Materials

MCOTI's high-performance thermal management materials cover a variety of thermally conductive material types to meet the needs of different applications. Thermal interface materials can effectively reduce thermal resistance, improve heat transfer efficiency, have good fit, temperature resistance and insulation, and are suitable for various electronic device thermal management scenarios, helping equipment to stabilize heat dissipation and extend service life.

Conductive Adhesive

Efficient conduction and stable connection. Conductive adhesive combines low contact resistance, high conductivity and excellent bonding performance, and can achieve simultaneous completion of conduction, fixation and sealing. It has excellent temperature resistance, moisture and heat resistance and long-term reliability, and is widely used in conductive bonding and packaging of crystal oscillators, PCBs, electronic components and precision components.

Preformed Products

Ideal for integration and lightweighting of electronic equipment. MCOTI provides preformed products such as thermal gaskets, conductive gaskets and foam sealing rings, which combine high thermal conductivity, EMI shielding, environmental sealing and buffering and shock-absorbing properties. They can meet the needs of multi-material composite design and rapid assembly, and provide reliable thermal management, protection and sealing solutions for electronic systems.

Display Bonding Adhesive

Navigation, infotainment, input screens and the head-up display are made up of different components that must be permanently connected to each other. MCOTI adhesives can be used to bond display frame structures to protective glass and to bond displays within sealed enclosures.

Industry solutions

New Energy Vehicles

Adhesives are not only "connecting materials" for new energy vehicles, but also core functional materials that ensure their safety, endurance, and reliability. As new energy vehicles upgrade to "high endurance, high safety, and lightweight," technological iterations of adhesives (such as higher thermal conductivity, lower VOC, and faster curing speed) will also become a key research and development direction.

Consumer Electronics

Innovation in adhesive technology for consumer electronics products is crucial to the miniaturization and reliability improvement of smart devices. It also makes the devices resistant to moisture and sweat and complies with industry standard testing. The increase in the frequency of electronic products puts forward more stringent requirements for circuit design, circuit board materials and adhesives. Adhesives are needed to solve capacitive noise phenomena and electromagnetic interference problems in high-frequency circuits.

Semiconductor

Adhesive is an essential functional material in semiconductor components, and the tin point machine can optimize packaging performance and process. Help semiconductor packaging companies improve product reliability, significantly shorten production cycles, reduce yield losses, and adapt to the diverse needs from traditional packaging to advanced packaging (such as Chiplets, 3D IC).

Data Center

As the core of computing power, data center servers need to work in harsh scenarios of 7×24 hours of high-load operation, high-density heat dissipation, and long-term stable service. The connection, heat dissipation, and protection of their internal components (such as CPU/GPU, power supply, and motherboard) all rely on adhesives to achieve key functions.

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We look forward to having in-depth exchanges with you and exploring more composite material application technologies and solutions.

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